MPN: DM52B13H-350 B
Alternate P/N: DM52B13H350B
NSN : 5962-01-310-8703
CAGE Code : 61394
Manufacturer: Seeq Technology Inc
Item Name : Microcircuit Memory
Limitless Purchasing is your sourcing solution for all of your NSN part needs like DM52B13H-350 B, offering rapid lead-times and competitive pricing on everything that we carry. Manufactured by Seeq Technology Inc, this Microcircuit Memory component is listed alongside the NSN part number DM52B13H-350 B for your ease of procurement. With current availability for this NSN part on our website, we invite you to begin the purchasing process by filling out the RFQ form as provided below. Once received by our team members, a dedicated account manager will review and respond in 15 minutes or less with a personalized quote that accommodates your individual needs and requirements.
NSN parts are those that follow the National Stock Number system as dictated by the United Nations, allowing for easier identification, supply, and procurement of standardized materials. As a leading distributor of NSN parts, we can help customers source the new, used, and obsolete components that they need from top global NSN parts manufacturers such as Seeq Technology Inc. If you are facing an Aircraft on Ground (AOG) situation, we also offer same-day and expedited shipping for a number of items that we carry. With over 2 billion items at your disposal, Limitless Purchasing can serve as your strategic sourcing partner for all of your operational needs. Get started on the purchasing process for NSN 5962013108703 and other parts such as DM52B13H-350 B that you have been searching for today and see what we can do for you!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-310-8703 Item Description: Microcircuit Memory | 5962 | 013108703 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Dm52b13h-350 B | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.599 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ERASABLE AND PROGRAMMABLE |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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