MPN: S82S131F 883B
Alternate P/N: S82S131F883B
NSN : 5962-01-249-4638
CAGE Code : 18324
Manufacturer: Philips Semiconductors Ltd
Item Name : Microcircuit Memory
Limitless Purchasing is your sourcing solution for all of your NSN part needs like S82S131F 883B, offering rapid lead-times and competitive pricing on everything that we carry. Manufactured by Philips Semiconductors Ltd, this Microcircuit Memory component is listed alongside the NSN part number S82S131F 883B for your ease of procurement. With current availability for this NSN part on our website, we invite you to begin the purchasing process by filling out the RFQ form as provided below. Once received by our team members, a dedicated account manager will review and respond in 15 minutes or less with a personalized quote that accommodates your individual needs and requirements.
NSN parts are those that follow the National Stock Number system as dictated by the United Nations, allowing for easier identification, supply, and procurement of standardized materials. As a leading distributor of NSN parts, we can help customers source the new, used, and obsolete components that they need from top global NSN parts manufacturers such as Philips Semiconductors Ltd. If you are facing an Aircraft on Ground (AOG) situation, we also offer same-day and expedited shipping for a number of items that we carry. With over 2 billion items at your disposal, Limitless Purchasing can serve as your strategic sourcing partner for all of your operational needs. Get started on the purchasing process for NSN 5962012494638 and other parts such as S82S131F 883B that you have been searching for today and see what we can do for you!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-249-4638 Item Description: Microcircuit Memory | 5962 | 012494638 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| S82s131f 883b | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.290 INCHES MINIMUM AND 0.380 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.300 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.302 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 614.4 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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