MPN: PAL16L8DMJ 883B
Alternate P/N: PAL16L8DMJ883B
NSN : 5962-01-331-7106
CAGE Code : 50364
Manufacturer: Mmi Amd
Item Name : Microcircuit Memory
Limitless Purchasing is your sourcing solution for all of your NSN part needs like PAL16L8DMJ 883B, offering rapid lead-times and competitive pricing on everything that we carry. Manufactured by Mmi Amd, this Microcircuit Memory component is listed alongside the NSN part number PAL16L8DMJ 883B for your ease of procurement. With current availability for this NSN part on our website, we invite you to begin the purchasing process by filling out the RFQ form as provided below. Once received by our team members, a dedicated account manager will review and respond in 15 minutes or less with a personalized quote that accommodates your individual needs and requirements.
NSN parts are those that follow the National Stock Number system as dictated by the United Nations, allowing for easier identification, supply, and procurement of standardized materials. As a leading distributor of NSN parts, we can help customers source the new, used, and obsolete components that they need from top global NSN parts manufacturers such as Mmi Amd. If you are facing an Aircraft on Ground (AOG) situation, we also offer same-day and expedited shipping for a number of items that we carry. With over 2 billion items at your disposal, Limitless Purchasing can serve as your strategic sourcing partner for all of your operational needs. Get started on the purchasing process for NSN 5962013317106 and other parts such as PAL16L8DMJ 883B that you have been searching for today and see what we can do for you!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-331-7106 Item Description: Microcircuit Memory | 5962 | 013317106 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Pal16l8dmj 883b | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND BIDIRECTIONAL |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZER | MEMORY DEVICE TYPE | PAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
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