MPN: IDT6116SA70L32B
NSN : 5962-01-316-5959
CAGE Code : 61772
Manufacturer: Integrated Device Technology Inc
Item Name : Microcircuit Memory
Limitless Purchasing is your sourcing solution for all of your NSN part needs like IDT6116SA70L32B, offering rapid lead-times and competitive pricing on everything that we carry. Manufactured by Integrated Device Technology Inc, this Microcircuit Memory component is listed alongside the NSN part number IDT6116SA70L32B for your ease of procurement. With current availability for this NSN part on our website, we invite you to begin the purchasing process by filling out the RFQ form as provided below. Once received by our team members, a dedicated account manager will review and respond in 15 minutes or less with a personalized quote that accommodates your individual needs and requirements.
NSN parts are those that follow the National Stock Number system as dictated by the United Nations, allowing for easier identification, supply, and procurement of standardized materials. As a leading distributor of NSN parts, we can help customers source the new, used, and obsolete components that they need from top global NSN parts manufacturers such as Integrated Device Technology Inc. If you are facing an Aircraft on Ground (AOG) situation, we also offer same-day and expedited shipping for a number of items that we carry. With over 2 billion items at your disposal, Limitless Purchasing can serve as your strategic sourcing partner for all of your operational needs. Get started on the purchasing process for NSN 5962013165959 and other parts such as IDT6116SA70L32B that you have been searching for today and see what we can do for you!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-316-5959 Item Description: Microcircuit Memory | 5962 | 013165959 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Idt6116sa70l32b | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 90.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND STATIC OPERATION AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
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