MPN: F17006404
NSN : 5962-01-259-2035
CAGE Code : 65519
Manufacturer: Fsg Inc
Item Name : Microcircuit Memory
Limitless Purchasing is your sourcing solution for all of your NSN part needs like F17006404, offering rapid lead-times and competitive pricing on everything that we carry. Manufactured by Fsg Inc, this Microcircuit Memory component is listed alongside the NSN part number F17006404 for your ease of procurement. With current availability for this NSN part on our website, we invite you to begin the purchasing process by filling out the RFQ form as provided below. Once received by our team members, a dedicated account manager will review and respond in 15 minutes or less with a personalized quote that accommodates your individual needs and requirements.
NSN parts are those that follow the National Stock Number system as dictated by the United Nations, allowing for easier identification, supply, and procurement of standardized materials. As a leading distributor of NSN parts, we can help customers source the new, used, and obsolete components that they need from top global NSN parts manufacturers such as Fsg Inc. If you are facing an Aircraft on Ground (AOG) situation, we also offer same-day and expedited shipping for a number of items that we carry. With over 2 billion items at your disposal, Limitless Purchasing can serve as your strategic sourcing partner for all of your operational needs. Get started on the purchasing process for NSN 5962012592035 and other parts such as F17006404 that you have been searching for today and see what we can do for you!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-259-2035 Item Description: Microcircuit Memory | 5962 | 012592035 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
F17006404 | 5 | 1 | C | A |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.400 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.594 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.280 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 4.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | LOW POWER AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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